IRVINE, Calif., Feb. 8 /PRNewswire-FirstCall/ — Broadcom Corporation (NASDAQ:BRCM) , a global leader in semiconductors for wired and Wireless communications, today announced a new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency (RF) transceiver solution that integrates all of the key 3G (third generation) cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments. The advanced baseband processor is the first to provide extremely high-speed cellular connectivity with advanced, built-in graphics capabilities, for HSUPA (high speed upstream packet access) applications. The RF transceiver solution complements the advanced HSUPA processor to provide support for all global frequency combinations covering the latest 3G-enabled devices.

Designed in Broadcom’s proven 65 nanometer CMOS process, the new ‘3G phone-on-a-chip’ and RF solution enables manufacturers to build low cost, low power, next generation 3G HSUPA phones with breakthrough features, sleek form factors and very long battery lives. Utilizing an integrated ARM11® processor that is capable of running popular open operating systems (such as Windows Mobile® and Android(TM)), the Broadcom® BCM21553 HSUPA baseband processor can run innovative new applications and download media files at a much faster speed, resulting in sophisticated and affordable handsets, and a more satisfying smartphone experience.

Highlights/Key Facts:

– Smartphones and smart featurephones continue to grow in popularity, with users attracted by the ability to download and use new software applications and view rich multimedia content. Highlighting the growing preference to use these phones for wirelessly accessing data, ABI Research projects over 350 petabytes of data will be transferred using smartphones in 2010, which is roughly equivalent to three times as much information as is contained in the Library of Congress.

– The Broadcom BCM21553 baseband processor enables the next generation of smartphones by supporting 3GPP (3rd Generation Partnership Project) releases 6 and 7, which provide up to 5.8 Mbps (Megabits per second) of upstream connectivity, 7.2 Mbps of downstream connectivity and support next generation CS (circuit switches) over HSPA services.

– Includes Broadcom PRISM (programmable interference suppression module) technology, which mitigates interference from radio signals emanating from neighboring cells, to provide higher performance gains in high interference environments where they’re needed the most.

– Integrates a high performance 3D graphics core with full support for the OpenGL® ES 2.0 graphics standard, providing rich 2D and 3D graphics for applications and advanced user interfaces.

– Open operating system (OS) support is a key requirement for today’s 3G smartphones, making these devices available to a broader range of software developers and innovative applications. By taking an Open OS approach, phones based on Broadcom technology can provide more mobile applications to users and an even better user experience.

– The BCM21553’s integrated high performance ARM11 processor can support Windows Mobile and Android open operating systems, eliminating the need for an external applications processor, which in turn saves size and cost, reduces system complexity, and improves battery life for 3G handset devices.

– The powerful graphics core built into the BCM21553 baseband processor is based on Broadcom’s advanced multimedia technology, providing Video support up to HVGA quality, an 8 megapixel camera, and the ability to encode and decode H.264 video at 30 fps (frames per second).

– Also introduced by the company today is the Broadcom BCM2091 radio frequency transceiver that provides RF connectivity for today’s announced BCM21553 HSUPA processor, enabling the industry’s smallest HSPA transceiver designed in a standard low cost, 65nm CMOS process.

The BCM2091 RF transceiver delivers the following:

– A highly flexible transceiver architecture that provides handset designers with ultimate flexibility in PCB board design and reuse across the various cellular band and mode configurations required worldwide

– Reduces external RF engine component count by more than 40% over existing RF engines in production today, which in turn reduces bill-of-materials (BoM) cost.

– The BCM21553 broadband processor and the BCM2091 RF transceiver are now available. Pricing is available upon request.

– A fully proven and tested reference design, including other leading Broadcom connectivity solutions (such as Bluetooth, WLAN, GPS and FM), will also be provided.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry’s broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.

Broadcom, one of the world’s largest fabless communications semiconductor companies, with 2009 revenue of $4.49 billion, holds more than 3,800 U.S. and 1,550 foreign patents, and has more than 7,800 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

A FORTUNE 500® company, Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.

Cautions regarding Forward Looking Statements:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward-looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management’s beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as “anticipates,” “expects,” “intends,” “plans,” “predicts,” “believes,” “seeks,” “estimates,” “may,” “will,” “should,” “would,” “could,” “potential,” “continue,” “ongoing,” similar expressions, and variations or negatives of these words. Examples of such forward-looking statements include, but are not limited to, the demand for high-speed 3G HSUPA connectivity, our position in that market, and references to Broadcom products enabling wireless and other capabilities in new handsets. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with the BCM21553 3G HSUPA broadband processor and the BCM2091 RF transceiver include, but are not limited to:

– the rate at which our present and future customers and end-users adopt Broadcom’s mobile technologies;

– trends in the wireless networking markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated;

– the gain or loss of a key customer, design win or order;

– the volume of our product sales and pricing concessions on volume sales;

– our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; and

– competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products.

Additional factors that may cause Broadcom’s actual results to differ materially from those expressed in forward-looking statements include, but are not limited to the list that can be found at www.broadcom.com/press/additional_risk_factors/[...].

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement, except as required by law.

Broadcom, the pulse logo, Connecting everything, and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

Designed as an ideal solution for Home Automation, Point of Sale and many other aesthetically demanding vertical markets the fanless PDX-089T is based on the 1GHz Vortex86DX CPU and features a Compact Flash and Micro SD slot, LAN, two USB 2.0 ports, one RS-232 port and Mini-PCI expansion. 512MB DDR2 memory is fitted as standard and optional audio line out, an additional USB port and wireless LAN are available on request.

Fitted with an 8.9″ 1024×600 resolution TFT display with user friendly viewing angles of 100° (vertical) and 140° (horizontal) and LED backlight with a predicted life of >25,000 hours, the unit also has USB analog resistive touch (with a durability of 1 million touches).

Weighing a mere 468g and housed in a really neat black die cast enclosure (236mm x 146mm x 35 mm) with VESA 75 mounting holes to the rear , the PDX-089T draws just 1.3A at 5V DC (5V AC adapter included) and has an operating temperature range of -5°C to +60°C.

The PDX-089T supports DOS, Linux, Windows CE and Windows XPe any of which can be supplied pre-installed to flash memory. A free of charge OS customisation service is available at OEM volumes.

Certified to CE, FCC, UL and VCCI the PDX-089T has an optional 8-35VDC input voltage and IP65 rated variants are shortly to be launched broadening its appeal to vehicular and marine applications.

Pricing for the system starts at an amazing £349 (50 off quantities).

On Saturday, January 30th, the Surface Mount Technology Corp sponsored robotics team from Hortonville High School won the Wisconsin FIRST Tech Challenge (FTC) competition, and is heading to the world championship in April. Surface Mount Technology Corp. provides sponsorship and Surface Mount Technology Corp. staff are involved in coaching the team.

Hortonville High School students Mitchell Kettner, Max Wilson, Sam Murphy and Trevor Carter won the Regional FIRST Tech Challenge (FTC) competition held at UW-Milwaukee on Saturday, January 30. Their team is known as the Kinetic Polar Bears. FIRST, which stands for “For Inspiration and Recognition of Science and Technology” is an organization founded by Segway inventor Dean Kamen to encourage grade school through high school students to develop an interest in science and technology. The FIRST Tech Challenge is a yearly nationwide competition in which high school student teams build robots to compete in a game that is defined by the FIRST organization and changes each year. Surface Mount Technology Corp., is a technology company, involved with the FIRST organization in both the FIRST Tech Challenge and in FIRST Lego League. This is a valuable opportunity to foster interest in technology in youth. For more information, see www.usfirst.org.

At the Wisconsin Regional competition, there were 17 teams from Wisconsin, Illinois, Michigan, and Iowa. Each team played in 7 qualifying matches, in which two alliances of two teams each square off in a 2 ½ minute match. The Surface Mount Technology Corp. sponsored team won 6 of 7 qualifying rounds to become the top seed in qualifying rounds. They picked an alliance team and won their semi-finals, and went on to win finals in four rounds after a loss, a tie, and two wins. One of the semi-final rounds can be viewed on Youtube at www.youtube.com/watch?v=wuxDzaaaUzc

Their first place finish against teams from around the Midwest qualifies them for World Competition in Atlanta Georgia in April.

For the second consecutive year this four-member team was awarded the judge’s award for Best Design for their effective, efficient, robust robot. The PTC Design Award is presented to teams that incorporate innovative industrial design elements into their solution. They were nominated for several other judges awards as well including the prestigious Inspire Award given to the team that truly embodies the ‘challenge’ of the FTC program.

Surface Mount Technology Corp. serves the Industrial Controls, Military (High Reliability), Medical and Automotive markets, by providing integrated electronic product development and manufacturing services, and provides solutions to decrease your products time to market. Surface Mount Technology Corp. offers a complete product life cycle of services including design, Prototype, Domestic and Off-Shore Assembly, High Level Assembly, Test solutions, Global Distribution and Continuing Product Support.

YORKTOWN HEIGHTS, N.Y. – 05 Feb 2010: In a just-published paper in the magazine Science, IBM (NYSE: IBM) researchers demonstrated a radio-frequency graphene transistor with the highest cut-off frequency achieved so far for any graphene device – 100 billion cycles/second (100 GigaHertz).

This accomplishment is a key milestone for the Carbon Electronics for RF Applications (CERA) program funded by DARPA, in an effort to develop next-generation communication devices.

The high frequency record was achieved using wafer-scale, epitaxially grown graphene using processing technology compatible to that used in advanced silicon device fabrication.

“A key advantage of graphene lies in the very high speeds in which electrons propagate, which is essential for achieving high-speed, high-performance next generation transistors,” said Dr. T.C. Chen, vice president, Science and Technology, IBM Research. “The breakthrough we are announcing demonstrates clearly that graphene can be utilized to produce high performance devices and integrated circuits.”

Graphene is a single atom-thick layer of carbon atoms bonded in a hexagonal honeycomb-like arrangement. This two-dimensional form of carbon has unique electrical, optical, mechanical and thermal properties and its technological applications are being explored intensely.

Uniform and high-quality graphene wafers were synthesized by thermal decomposition of a silicon carbide (SiC) substrate. The graphene transistor itself utilized a metal top-gate architecture and a novel gate insulator stack involving a polymer and a high dielectric constant oxide. The gate length was modest, 240 nanometers, leaving plenty of space for further optimization of its performance by scaling down the gate length.

It is noteworthy that the frequency performance of the graphene device already exceeds the cut-off frequency of state-of-the-art silicon transistors of the same gate length (~ 40 GigaHertz). Similar performance was obtained from devices based on graphene obtained from natural graphite, proving that high performance can be obtained from graphene of different origins. Previously, the team had demonstrated graphene transistors with a cut-off frequency of 26 GigaHertz using graphene flakes extracted from natural graphite.

Leuven, February 7, 2010 – At today’s International Solid State Circuit Conference, imec and Holst Centre report an analog-signal processor ASIC (application-specific integrated circuit) – in short ASP – that reduces the overall power consumption of an ambulatory heart activity signal monitoring systems by more than 5 times. This is a major step towards autonomous wireless sensor systems powered, which constantly monitor the patient’s health for diagnosis or chronic illness.

In today’s biomedical wireless sensor systems, a lot of power consumption is wasted in the DSP (digital signal processor) or radio by continuously processing biopotential signals (e.g. ECG or electrocardiogram), or transmitting raw data over the wireless link. And, today’s ambulatory biomedical sensor systems also suffer from motion artifacts which affects the robustness of detection algorithms and demands even more processing power.

The innovative ASP, developed within imec’s and Holst Centre’s HUMAN++ program, uses an adaptive sampling scheme based on activity detection. This reduces the amount of data which needs to be processed by the DSP or transmitted by the radio. By preprocessing the signal, a simplified DSP can be used for accurate R-peak detection resulting in lower power consumption of the DSP. Motion artifacts are detected by continuously monitoring the electrode-tissue impedance. The impedance monitoring can also be used for ensuring signal integrity by continuously checking the electrode connectivity.

The ASP has a record low power consumption of only 30µW operating from 2V. It consists of an ECG readout channel, two quadrature readout channels for continuous-time monitoring of electrode-tissue impedance, and two quadrature readout channels for tracking signal fluctuations in a specific frequency band. The ASP also includes an activity detector that senses the frequency content of the ECG signal and adapts the sampling rate of the integrated ADC (analog to digital convertor) for the digitization of the ECG signal. The ASP stage reduces the power consumption of the DSP and wireless transmission by 11 and 6 times respectively. This results in an overall system power dissipation below 300µW for the complete wireless heart activity signal monitoring system which is more than 5 times more power efficient than its predecessors. This power budget also includes the additional functionality of continuous-time electrode-tissue contact impedance measurement.

“Within the Human++ program, imec and Holst Centre develop solutions for an efficient and better healthcare. Self-powered intelligent body area networks with wireless sensors promise to be a solution for more comfortable healthcare systems. This breakthrough is a major step towards constant ambulatory monitoring of people using energy harvesting, which increases the comfort level of patients and is a cost- and time-efficient alternative for current monitoring systems;” said Bert Gyselinckx, general manager imec the Netherlands at Holst Centre.

Industry can get access to this technology by joining the Human++ program as research partner or by licensing agreements for further product development.

This news release can be downloaded at www2.imec.be/be_en/press/imec-news/biopotential[...]

NOTE TO EDITORS: At this week’s International Solid State Circuit Conference, imec and Holst Centre present their newest breakthroughs in ultra-low power design for wireless communications and wireless sensor networks and in organic electronics with an impressive number of contributions including 10 reviewed publications and 6 contributions to tutorials and workshops.

The news release is based on paper 6.6: A 30μW Analog Signal Processor ASIC for Biomedical Signal Monitoring.

About imec

Imec performs world-leading research in nano-electronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society.

Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China and Japan. Its staff of more than 1,650 people includes over 550 industrial residents and guest researchers. In 2008, imec’s revenue (P&L) was 270 million euro.

Further information on imec can be found at www.imec.be.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government) and imec Taiwan (IMEC Taiwan Co.).

About Holst Centre

Holst Centre is an independent open-innovation R&D centre that develops generic technologies for Wireless Autonomous Transducer Solutions and for Systems-in-Foil. A key feature of Holst Centre is its partnership model with industry and academia around shared roadmaps and programs. It is this kind of cross-fertilization that enables Holst Centre to tune its scientific strategy to industrial needs.

Holst Centre was set up in 2005 by imec (Flanders, Belgium) and TNO (The Netherlands) with support from the Dutch Ministry of Economic Affairs and the Government of Flanders. It is named after Gilles Holst, a Dutch pioneer in Research and Development and first director of Philips Research.

Located on High Tech Campus Eindhoven, Holst Centre benefits from the state-of-the-art on-site facilities. Holst Centre has over 150 employees from around 25 nationalities and a commitment from over 20 industrial partners.

EC5-1813L2NA is based on Intel’s 32nm process technology and dual-chip platform, which integrates Northbridge in the CPU and provides high performance, energy saving, management function, security protection and smoother visual experience.

EC5-1813L2NA module provides high performance on low TDP and supports Intel® PGA988 package 32nm dual-core i series Arrandale CPU: Intel® Core i7 processor i7-620M and Intel® Core i5 processor i5-520M. EC5-1813L2NA is equipped with two 204-pin DDR3 slots(non-ECC), supporting up to 8GB memory. It has powerful expansibility and abundant I/O ports, and supports various video display devices, including HDMI, dual-channel 18/24-bit LVDS, VGA and dual independent display devices. EC5-1813L2NA supports 4 x SATA interface, 6 x COM port, 8 x USB 2.0 port, 8-bit GPIO and 1 x PCI-E x4, 1 x Mini PCI-E slot, 4 x PCI master device, 1 x PCI-E x16 and 1 x PCI-E x1 expansion which complies with PCI/104-ExpressTM&PCIe/104TM Specification Version 1.0 standard. The product also has two high-speed Ethernet ports to support high-speed network access and its flexible requirements.

EC5-1813L2NA is ideally suitable for a wide range of applications, such as medical equipment, PoS/Kiosks, digital sinage, security monitoring equipment, automation controller, etc. EC5-1813L2NA is compatible with Microsoft Win7/ XP/ XPe/ Vista and Linux operating platform.

EVOC is one of the leading manufacturers of embedded and industrial computing products. It has over 1,500 types of products, including Fanless Systems, ETX/Com-Express, Full-size CPU Card, Half-size CPU Card, 3.5″ Single Board, 5.25″ Single Board, EPIC Board, Industrial Panel PC, Workstation, PC/104 product, CompactPCI, Network Application Platform, Rugged Laptop and OEM/ODM services. As a high-tech company, EVOC devotes itself to providing highly reliable and stable embedded products and system-integrated solutions for various applications, such as banking, electric power, electronics, energy, environmental protection, gaming, instrumentation, manufacturing, medical care, networking, telecoms and transportation, etc.

EVOC is an Affiliate Member of the Intel Embedded Alliance, a community of embedded developers and solution providers.

ARBOR’s FPC series is presenting extremely reliability, robust design, fanless operation and complete expandability. The high-performance FPC-5100 series, targeting at industrial control application, is built with Intel 945GME/ICH7M chipset and supports the Intel socket M Core Duo/Core 2 Duo/Celeron M processors. The FPC-5100 series features high performance, wide range DC power input (10V~28V), high shock/vibration resistance and heat-prevention design, expanded temperature range, rich I/O ports, easy installation & maintenance, and multiple display integration. With these superior features, the FPC-5100 series is suitable to be installed in limited space for industrial automation, AFC (Automatic Fare Collection), Intelligent Transportation, digital signage (DSA), gaming machine and vehicle system applications.

To improve the rate of heat transfer, the case made of aluminum is designed with fins that increases the surface area for more effective heat dissipation. Rich communication interface is essential and critical to success in industrial automation application. The FPC-5100 series is equipped with two DDRII memory DIMM sockets (up to 4GB), 2.5” HDD/SSD drive bay, CF socket, two Gigabit Ethernet ports, seven USB 2.0 ports, six serial ports, 16-bit Digital I/O port, IEEE 1394a port, PCI slot and Mini-card slot. The FPC-5100 series, measuring 254.8 x 187 x 80 mm, supports an industrial temperature range of -20ºC to 70ºC to meet tough requirements in space-critical and harsh environment applications. The robust design enhances the product reliability and stability certified by industrial product quality test including anti-vibration (3G), anti-shock (60G) & anti-crash (80G).

Additionally, the mechanical modular design facilitates maintenance or possible upgrades. Modular Box PC can be easily modified to fit many different applications according to customers’ requests. For example, the FPC-5100A is equipped with a hot-swappable system cooling fan, which is convenient for users to replace it without having to turn off the computer. The FPC-5100 series is a very flexible and reliable automation control solution. It empowers the user to select components, such as the CPU, Storage, hot-swappable fan module, depending on the performance level they want the appliance to achieve. For further information, please visit: www.arbor.com.tw/products/detail.aspx?Product_N[...] or contact with ARBOR representatives at: info@arbor.com.tw.

About ARBOR

Since founded in 1993, ARBOR Tech. has been specializing in embedded computing and networking solutions to help realize the vision of “Digital Enterprise & Digital Life.” We have been delivering numerous successful projects for our customers with outstanding results in terms of adopting advanced embedded design, severe test & measurement and quick response to market changes. ARBOR provides a full fleet of embedded computing platforms from board to system, which let you cover the needs of networking communication, industrial control, process control, transportation control, eHealthcare, mobile management, POS & Kiosk and Tablet PC.

ARBOR is an ISO-9001 certified embedded & networking manufacturer and commits to deliver high quality products with international standard and well-defined production process. Also, ARBOR was awarded the “Taiwan Symbol of Excellence Award” by its products, which verifies its efforts and commitment to embedded computing. As a member of the Intel® Embedded Alliance, ARBOR realizes your embedded computing vision with the most advanced Intel® embedded computing solutions. ARBOR has intensive operations across the world and deploys embedded computing solutions to every corner wherever you are.

Media Contact : marcom@arbor.com.tw

Inquiry Contact : info@arbor.com.tw

WILSONVILLE, Ore., February 4, 2010 — Mentor Graphics Corporation (NASAQ: MENT) today announced that ASIA Company, a Korea-based wire harness supplier, has made dramatic gains by deploying the CHS™ software. The CHS tool has enabled ASIA to add significant automation and cut their wire harness design cycle time by up to 75 percent.

ASIA supplies GM-Daewoo, which in turn uses standardized General Motors design tools and methodology. ASIA’s challenge was to automate the previously manual transcription of Daewoo design data into ASIA’s internal systems. This design data is originated in multiple tools, including Siemens-PLM’s NX 3D MCAD application, and is further complicated by a high rate of change and the presence of optional content. ASIA has now deployed Capital® HarnessXC, one of the core CHS tools, to intelligently merge the data streams and perform automated engineering tasks such as checking, component selection and drawing creation. This in turn led to the large design cycle time savings reported.

Namgyung Y-Chief of ASIA’s R&D Center said, “CHS fully automates data transcription and harness engineering. Not only can we read in Daewoo’s design information, we can also drive the resultant engineering data onwards to our production systems, creating further efficiencies.”

ASIA’s success further consolidates Mentor’s position in the region; several other Korea-based wire harness suppliers also use CHS to implement efficient, correct-by-construction design processes.

Nick Smith, business development director of Mentor’s Integrated Electrical Systems Division, said, “The challenge ASIA faced is exactly what Capital HarnessXC was created for. The tool itself is very flexible. It can receive data from a wide variety of electrical, mechanical and other CAD tools, and also supports emerging standards such as KBL. ASIA’s implementation is a perfect example of the benefits that can be derived from a seamless digital data flow coupled with engineering automation.”

About Mentor Graphics

Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of about $800 million and employs approximately 4,425 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: www.mentor.com/.

London, February 4, 2010

A full technical programme for DATE 2010, the major global event in Europe which is set to shape the future of the worldwide electronics industry, is now available at:

www.date-conference.com

The conference will take place at the ICC in Dresden, Germany from 8-12 March 2010. Dresden, is well-known for its Elbe Valley and its numerous monuments from the 16th to 20th centuries and is the home of Silicon Saxony, Europe’s largest network in the semiconductor, electronics, and microsystems industry.

‘With a record number of submissions from six different continents DATE 2010 offers an outstanding technical programme of 77 technical sessions including 12 special sessions such as panels and hot topic sessions. The programme features the most recent industrial trends and new research findings which will have a significant impact on the future of the electronics industry and academic research.’, says Wolfgang Müller, DATE’10 Technical Programme Chair.

DATE 2010 begins on Monday 8 March with one full day of tutorials and ends on Friday 12 March with workshops on current and emerging issues in electronic systems design, test, and embedded software.

Monday tutorials provide wide choice of topics including life sciences and biometrics applications, nanoscale test, 3D integration, asynchronous systems, low power, ESL verification, SystemC AMS, and AUTOSAR.

Tuesday opening keynotes are delivered by:

Alberto Sangiovanni-Vincentelli

U.C. Berkeley and Cadence Design Systems, USA,

and

Hermann Eul

Executive Vice President Infineon and University of Hannover, Germany

These events will set the focus on complex systems and wireless communication providing an outlook beyond the current market conditions.

The second highlight on Tuesday is the executive track which will feature business panels with executive-level speakers from leading companies such as AMD, Intel, IBM, Infineon, TI, TSMC – to mention but a few.

Two special days on Wednesday and Thursday are dedicated to two major domains:

Cool Electronic Systems and Nanoelectronics with keynotes by

Mark Horowitz (Stanford University) and Dimitris Antoniadis (MIT).

applications with a dedicated user-oriented application track over three days.

DATE’s Friday Workshops programme includes six workshop themes ranging from technology to architecture to embedded software: 3D integration, process variability, silicon debugging, multi/many-core parallel platforms, reconfigurable computing and model-based engineering.

DATE’10 will also boost two new exhibition initiatives which will be open to conference delegates as well as to exhibition visitors.

Tool vendors such as Synopsys, Mentor Graphics and Cadence will organise half-day tool seminars and European vendors will join forces at the EDA village.

‘Strengthening the link between research, innovation and applications is what is needed in these times more than ever. DATE’10 will be THE event where you meet leading experts from Universities and industry.’, says Prof. Giovanni De Micheli, DATE’10 General Chair.

For further information and advanced registration until February 12, please visit:

www.date-conference.com.

DATE’10 Press Contacts:

General Chair – Giovanni De Micheli, EPFL, Switzerland

giovanni.demicheli@epfl.ch

Programme Chair – Wolfgang Müller, University of Paderborn, Germany

wolfgang@acm.org

Press Chair – Fred Santamaria, France

fredmarcom@aol.com

Event Management – Sue Menzies, European Conferences, UK – tel: +44 131 225 2892

sue.menzies@ec.u-net.com

Mansfield, Texas, USA – February 4, 2010 – Mouser Electronics, Inc., known for its rapid introduction of the newest products, is the first to announce the availability of the much anticipated USB 3.0 SuperSpeed connectors from Amphenol. The USB (Universal Serial Bus) 3.0 connectors are fully compliant with the USB 2.0 and 3.0 specification and offer a significant leap forward in transfer speeds (5 Gbps signaling rate) and a 10x performance increase over Hi-Speed USB capabilities, while maintaining backwards compatibility with USB 2.0 devices.

The improvements to the USB 3.0 SuperSpeed connectors provide a solution for increasingly sophisticated peripherals that require more power and improved interaction between devices and the host computer by providing more power when needed and less power when not needed.

Mouser’s stock of Amphenol’s USB 3.0 includes Type A, Type B, and Micro-B connectors that provide full metal shielding for EMI, RFI, and ESD protection. Amphenol’s USB 3.0 connectors are ideal for improving the performance of external hard drives, high res webcams, video surveillance, and Blu-ray drives. To learn more, visit www.mouser.com/AmphenolCommUSB3/.

Keith Privett, Mouser’s Vice President, Interconnect, regards the availability of the USB 3.0 connectors from Amphenol USB 3.0 as an exciting opportunity. “With 5-10 times the bandwidth, USB 3.0 provides customers with a high speed connector solution for next generation devices. The USB has now caught up with the peripherals that it was supporting. This advance in technology is one of the most important technological advances for interconnects in recent memory.”

Known for its broad-based product line, unsurpassed customer service, and streamlined warehouse operations, Mouser continuously offers customers the most innovative products and latest technologies for their new design projects.

Mouser Electronics’ website with interactive online catalog is updated daily, and searches over 5 million products to locate over a million part numbers available for easy online purchase. Plus, downloadable data sheets, supplier-specific reference designs, application notes, technical design information and engineering tools.

About Mouser

Mouser Electronics, Inc. is an electronic component distributor, focused on the rapid introduction of new products and technologies to electronic design engineers. Mouser.com features more than a million products online from more than 400 manufacturers. Mouser publishes multiple catalogs a year providing designers with up-to-date data on the components now available for the next generation of electronic devices. Mouser ships globally to over 270,000 customers in 170 countries from its 432,000 sq. ft. state-of-the-art facility in Mansfield, Texas. For more information, visit www.mouser.com.

About Amphenol Commercial Products

Amphenol Commercial Products division is a world leader in providing interconnect solutions into a wide range of markets and applications, These products include Board Level connectors, Internal I/O, External I/O, and Portable Device Connectors targeted to the Networking, Telecom, Server & Computer, Storage & HDD, Consumer Electronics, and Entertainment & Industrial products markets.

Trademarks

Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. All other products, logos, and company names mentioned herein may be trademarks of their respective owners.

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